2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
Canadian Solar - HiKuBlack - Black Backsheet & Frame (Mono)
Aesthetic appearance for residential systems: With black backsheet & black frame, Power range 380 ~ 405 W, Low power loss in cell connection. Enhanced reliability: · Low temperature coefficient (Pmax): -0.34 % / °C, LID LeTID less than 2.0%, Lower hot spot temperature, Better shading tolerance.
